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Correlation of silver migration with temperature-humidity-bias (THB) failures in multilayer ceramic capacitorsLING, H. C; JACKSON, A. M.IEEE transactions on components, hybrids, and manufacturing technology. 1989, Vol 12, Num 1, pp 130-137, issn 0148-6411, 8 p.Article

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Reducing dielectric losses in MnZn ferrites by adding TiO₂ and MoO₃ZHU, J; TSENG, K. J.IEEE transactions on magnetics. 2004, Vol 40, Num 5, pp 3339-3345, issn 0018-9464, 7 p.Article

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Advances in Passive Imaging Elements with Micromirror ArrayMAEKAWA, Satoshi; NITTA, Kouichi; MATOBA, Osamu et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, pp 68030B.1-68030B.11, issn 0277-786X, isbn 978-0-8194-6975-5, 1VolConference Paper

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Quality and reliability aspects of passive componentsO'CONNOR, Patrick.Quality and reliability engineering international. 1998, Vol 14, Num 2, pp 61-102, issn 0748-8017Conference Proceedings

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Passive components for high power networksDONVAL, Ariela; GOLDSTEIN, Sharon; MCILROY, Peter et al.SPIE proceedings series. 2004, isbn 0-8194-5526-1, Part 2, 724-728Conference Paper

Extraction of channel length and junction voltage in n⁺/n/n⁺ or n⁺/p/n⁺ polysilicon resistorsRODDER, M; MADAN, S. K.I.E.E.E. transactions on electron devices. 1992, Vol 39, Num 8, pp 1968-1970, issn 0018-9383Article

Electrostatic discharge (ESD) sensitivity of thin-film hybrid passive componentsTHIET THE LAI.IEEE transactions on components, hybrids, and manufacturing technology. 1989, Vol 12, Num 4, pp 627-638, issn 0148-6411Conference Paper

Integrated passive component technology education projectULRICH, Richard.Proceedings - Electronic Components Conference. 2002, pp 772-779, issn 0569-5503, isbn 0-7803-7430-4, 8 p.Conference Paper